Stackable microelectronic package structures

ABSTRACT

A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package.

BACKGROUND OF THE INVENTION

The present invention relates to improved microelectronic packages andto methods of making such packages.

Microelectronic elements generally comprise a thin slab of asemiconductor material, such as silicon or gallium arsenide, commonlycalled a die or a semiconductor chip. Semiconductor chips typicallyembody large numbers of active or passive devices which can beelectrically connected together internally to perform circuit function,e.g., as an integrated circuit. Semiconductor chips are commonlyprovided as individual, prepackaged units. In some unit designs, thesemiconductor chip is mounted to a substrate or chip carrier.

Despite the advances that have been made in semiconductor packaging,there is still a need for improvements which may help to reduce theoverall size of the package, while enhancing electrical interconnectionreliability. These attributes of the present invention are achieved bythe construction of the microelectronic packages and methods of makingthe microelectronic packages as described hereinafter.

BRIEF SUMMARY OF THE INVENTION

An aspect of the present disclosure relates to a microelectronicassembly including a first microelectronic package having a substratewith first and second opposed surfaces and substrate contacts thereon.The first package further includes first and second microelectronicelements, each having element contacts electrically connected with thesubstrate contacts, the first and second microelectronic elements beingspaced apart from one another on the first surface so as to provide aninterconnect area of the first surface between the first and secondmicroelectronic elements. A plurality of package terminals at the secondsurface are electrically interconnected with the substrate contacts forconnecting the package with a component external to the package. Aplurality of stack terminals are exposed at the first surface in theinterconnect area for connecting the package with a component overlyingthe first surface of the substrate. The assembly further includes asecond microelectronic package overlying the first microelectronicpackage and having terminals joined to the stack terminals of the firstmicroelectronic package.

The package terminals and the stack terminals can overlie each other inrespective electrically connected pairs. In an example, the packageterminals and the stack terminals can be opposite ends of conductivevias through the substrate.

Additional ones of the stack terminals can be at the first surface ofthe substrate in a portion thereof that is outside of the interconnectarea. In an embodiment, the first microelectronic package can furtherinclude third and fourth microelectronic elements spaced on oppositesides of the interconnect area between the first and secondmicroelectronic elements. In such an embodiment, the additional ones ofthe stack terminals can be in a corner region of the substrate boundedby adjacent ones of the microelectronic elements. Additionally oralternatively, at least some of the stack terminals can be connectedwith both of the first and second microelectronic elements. In such anexample, at least some of the stack terminals that are connected withboth of the first and second microelectronic elements can be configuredto carry at least one of command, address, and timing signals.

The first microelectronic package can further include a moldedencapsulant layer overlying at least a portion of the first surface ofthe substrate, and at least portions of the first conductiveinterconnects can comprise first conductive vias extending through themolded encapsulant layer to exposed ends. In an embodiment,contact-bearing faces of the first and second microelectronic elementscan face the substrate, the substrate contacts including substratecontacts exposed at the second surface, and the element contacts can beconnected with the substrate contacts by wire bonds.

The microelectronic assembly can include substrate contacts exposed atthe first surface. In such an embodiment, the element contacts of thefirst and second first microelectronic elements can face the substratecontacts exposed at the first surface and can be joined thereto.

The second microelectronic package can include a third microelectronicelement mounted on a second substrate. In such an embodiment, theterminals of the second package can be on the second substrate andelectrically connected with the third microelectronic element. In anexample, the second microelectronic package can include a substratehaving first and second spaced apart surfaces and third and fourthmicroelectronic elements mounted on the second surface thereof. Thethird and fourth microelectronic elements can be spaced apart on thesubstrate of the second package to define an interconnect area therein,and the terminals can be exposed at the second surface of the substrateof the second package within the interconnect area. The substrate of thesecond package can further include a window extending therethroughbetween the first and second surfaces thereof, and the terminals of thesecond package can be joined to the stack terminals of the first packageby wire bonds that extend through the window. In a further embodiment,the substrate of the first package can define a peripheral areasurrounding at least one of the first and second microelectronicelements, additional stack terminals being located in the peripheralarea. The peripheral area can surround at least one of the third andfourth microelectronic elements and a peripheral edge can bound theperipheral area. Additional terminals can be located in the peripheralarea thereof, and at least some of the additional stack terminals of thefirst package can be joined with at least some of the additionalterminals of the second package by wire bonds that extend past theperipheral edge of the substrate of the second package.

A third microelectronic package can overlie the first microelectronicpackage and can have terminals joined to the stack terminals of thefirst microelectronic package. Further, the microelectronic assembly caninclude a circuit panel with circuit contacts exposed at a surfacethereof. The package terminals of the first microelectronic package canbe electrically connected with the circuit contacts. The secondmicroelectronic package terminals can be at least one of packageterminals or stack terminals. The stack terminals of the first packagecan be electrically connected with the package terminals of the secondpackage. Further, the stack terminals of the first and second packagescan be electrically connected.

The microelectronic assembly can further include a heat spreader betweenthe first and second microelectronic packages. The heat spreader canhave an aperture formed therethrough that overlies at least a portion ofthe interconnect area. The stack terminals of the second microelectronicpackage can be connected with the stack terminals of the firstmicroelectronic package through the aperture. The heat spreader can be afirst heat spreader, in an embodiment of an assembly that furtherincludes a second heat spreader, the first heat spreader being disposedon a first side of the interconnect area and the second heat spreaderbeing disposed on a second side of the interconnect area. A gap can bedefined between the first and second heat spreaders, and the stackterminals of the second microelectronic package can be connected withthe stack terminals of the first microelectronic package through thegap.

Another aspect of the present disclosure relates to a microelectronicassembly including a first microelectronic package having first andsecond microelectronic elements. Each microelectronic element has frontfaces and back faces thereof and element contacts exposed at therespective front faces. The first and second microelectronic elementsare laterally spaced apart from one another so as to provide aninterconnect area therebetween. The first package further has adielectric layer having a surface overlying the front faces of the firstand second microelectronic elements and facing away from the front facesof the microelectronic elements. The dielectric layer further has asecond surface opposite the first surface. A plurality of packageterminals are exposed at the first surface of the dielectric layer andare electrically connected with the element contacts through tracesextending along the dielectric layer and first metallized vias extendingfrom the traces and contacting the element contacts. A plurality ofstack terminals are exposed at the second surface of the dielectriclayer and electrically connected with the package terminals forconnecting the package with a component overlying the second surface ofthe dielectric layer. The assembly further includes a secondmicroelectronic package overlying the first microelectronic package andhaving terminals joined to the stack terminals of the firstmicroelectronic package.

In an example, the first package can further include a moldedencapsulation layer at least partially surrounding the first and secondmicroelectronic elements within the interconnect area and defining asurface thereof overlying the second surface of the dielectric layer.Conductive interconnects can be electrically connected with the stackterminals and having end surfaces exposed at the surface of the moldedencapsulation layer.

Yet another aspect of the present disclosure relates to amicroelectronic assembly including a first package, having a substratewith first and second opposed surfaces. The first package furtherincludes first and second microelectronic elements each having elementcontacts electrically connected with corresponding substrate contacts onthe first surface. The first and second microelectronic elements arespaced apart from one another on the first surface so as to provide aninterconnect area of the first surface between the first and secondmicroelectronic elements. A plurality of package terminals at the secondsurface are electrically interconnected with the substrate contacts forconnecting the package with a component external to the package. Aplurality of stack terminals exposed at the first surface of thesubstrate in the interconnect area are electrically connected with atleast some of the package terminals. The assembly further includes asecond microelectronic package overlying the first microelectronicpackage and having terminals. A plurality of conductive interconnectsare joined between the stack terminals of the first microelectronicpackage and the terminals of the second microelectronic package.

The second microelectronic package can further have a second dielectriclayer having first and second opposed surfaces and at least onemicroelectronic element mounted on the first surface of the dielectriclayer.

A microelectronic assembly according to another embodiment of thepresent disclosure includes a first package having a substrate havingfirst and second opposed surfaces and four microelectronic elements eachhaving element contacts electrically connected with correspondingsubstrate contacts on the first surface. The microelectronic elementsare arranged on the first surface so as to define an interconnect areaof the first surface surrounded by the microelectronic elements. Aplurality of package terminals at the second surface are electricallyinterconnected with the substrate contacts for connecting the packagewith a component external to the package. A plurality of stack terminalsat the first surface in the interconnect area are electrically connectedwith the package terminals. The assembly further includes secondmicroelectronic package overlying the first microelectronic package andhaving terminals. Conductive interconnects are joined between the stackterminals of the first microelectronic package and the terminals of thesecond microelectronic package. Each of the microelectronic elements caninclude a peripheral edge adjacent to the interconnect area such thatthe interior interconnect area is defined as a rectangular area. Atleast some of the first conductive elements can be electricallyconnected with at least two of the first microelectronic elements.

Another aspect of the present disclosure relates to a microelectronicassembly including a first package, having a substrate with first andsecond opposed surfaces. The first package also includes first andsecond microelectronic elements each having element contactselectrically connected with corresponding substrate contacts on thefirst surface, the first and second microelectronic elements beingspaced apart from one another on the first surface so as to provide aninterconnect area of the first surface between the first and secondmicroelectronic elements. A plurality of contact pads have surfacesexposed at the second surface of the substrate, the surfaces of thecontact pads defining package terminals electrically interconnected withthe substrate contacts for connecting the package with a componentexternal to the package. A molded encapsulant layer overlies at least aportion of the first surface of the substrate and defines an encapsulantsurface. The assembly further includes a second microelectronic packagebonded to the encapsulant surface and having terminals facing theencapsulant surface. A plurality of conductive vias extend at leastthrough the molded encapsulant layer and connect the contact pads of thefirst microelectronic package and the terminals of the secondmicroelectronic package.

The conductive vias can further extend through the contact pads of thefirst package in electrical contact therewith. The secondmicroelectronic package can further include a substrate having first andsecond spaced apart surfaces. The second surface can be bonded to theencapsulant surface, and the terminals of the second package can besurfaces of conductive pads exposed at the second surface of thesubstrate. The conductive vias can further extend through the conductivepads of the second package in electrical contact therewith.

A system according to another aspect of the present disclosure caninclude a microelectronic assembly according to any of the embodimentsdiscussed above and one or more other electronic components electricallyconnected to the microelectronic assembly.

A further aspect of the present disclosure relates to a method formaking a microelectronic assembly. The method includes assembling afirst microelectronic package with a second microelectronic package, thesecond microelectronic package overlying the first microelectronicpackage and having terminals thereon. The first microelectronic packageincludes a substrate having first and second opposed surfaces andsubstrate contacts thereon. The first package further includes first andsecond microelectronic elements, each having element contactselectrically connected with the substrate contacts. The first and secondmicroelectronic elements are spaced apart from one another on the firstsurface so as to provide an interconnect area of the first surfacebetween the first and second microelectronic elements. A plurality ofpackage terminals at the second surface electrically interconnect withthe substrate contacts for connecting the package with a componentexternal to the package. A plurality of stack terminals are exposed atthe first surface in the interconnect area for connecting the packagewith a component overlying the first surface of the substrate. Themethod further includes connecting the terminals of the secondmicroelectronic package with the stack terminals of the firstmicroelectronic package to form an electrical connection therebetween.

In an embodiment, the step of connecting the terminals of the secondmicroelectronic package with the stack terminals of the firstmicroelectronic package includes joining the package terminals toexposed ends of interconnects on an encapsulant layer of the firstmicroelectronic package overlying the first surface of the substrate atleast in the interconnect area thereof. In such an example, theinterconnects can be joined to the stack terminals opposite the exposedends thereof. In another embodiment, the step of connecting theterminals of the second microelectronic package with the stack terminalsof the first microelectronic package can includes depositing conductivebond material masses into holes within an encapsulant layer of the firstmicroelectronic package overlying the first surface of the substrate atleast in the interconnect area. In such an embodiment, the stackterminals can be exposed at a surface of the encapsulant layer withinthe holes, and the conductive bond material masses can be joined to theterminals of the second package and the stack terminals of the firstpackage.

In a further embodiment, the step of connecting the terminals of thesecond microelectronic package with the stack terminals of the firstmicroelectronic package can includes forming a plurality of holesthrough at least an encapsulant of the first microelectronic packageoverlying the first surface of the substrate in at least theinterconnect area thereof. The plurality of holes can be aligned withrespective ones of the stack terminals at first ends thereof and withcorresponding ones of the terminals of the second package at second endsthereof. Such a method can further include filling the holes with aconductive material in contact with the stack terminals of the firstmicroelectronic package and the package terminals of the second package.The holes can be further formed through the substrate of the firstpackage and through the respective stack terminals thereof.Alternatively, the holes can be further formed through a substrate ofthe second package and through the corresponding terminals thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present invention will be now described withreference to the appended drawings. It is appreciated that thesedrawings depict only some embodiments of the invention and are thereforenot to be considered limiting of its scope.

FIG. 1 is a sectional view of an assembly including microelectronicpackages according to an embodiment of the present disclosure;

FIG. 2 is a sectional view of a further assembly including additionalmicroelectronic packages as shown in FIG. 1;

FIGS. 3A-3C are sectional views of alternative assemblies incorporatingalternative microelectronic packages;

FIG. 4 is a sectional view of an alternative assembly of alternativemicroelectronic packages;

FIGS. 5A and 5B are sectional views of further alternative assemblies ofalternative microelectronic packages;

FIG. 6 is an alternative assembly including microelectronic packages ofthe type shown in FIG. 1;

FIG. 7 is a further alternative assembly including microelectronicpackages of the type shown in FIG. 1;

FIGS. 8-10 are sectional views of various assemblies of furtheralternative microelectronic packages according to further embodiments ofthe present disclosure;

FIG. 11 is an assembly of the type shown in FIG. 6 incorporatingmicroelectronic packages as shown in FIG. 8;

FIG. 12 is an assembly of the type shown in FIG. 7 incorporatingmicroelectronic packages as shown in FIG. 8;

FIG. 13 is a section view of an assembly including additionalmicroelectronic elements of the type shown in FIG. 8;

FIG. 14 is a sectional view of an assembly of further alternativemicroelectronic packages;

FIG. 15 is a top plan view of a microelectronic package as used in theassembly shown in FIG. 14;

FIGS. 16 and 17 are top plan views of alternative microelectronicpackages that can be used in the assembly shown in FIG. 14; and

FIG. 18 shows a system including a microelectronic assembly according toan embodiment of the present disclosure.

DETAILED DESCRIPTION

Turning now to the figures, where like reference numbers are used toindicate similar features, FIG. 1 shows a microelectronic assembly 8 ofmicroelectronic packages 10A and 10B on a circuit panel 70. In theembodiment shown, packages 10A and 10B are substantially identical andeach includes a plurality of microelectronic elements 40 mounted on thefront face 14 of a substrate 12. In one example, each microelectronicelement may be or include a semiconductor chip embodying a plurality ofactive circuit elements, e.g. semiconductor devices, which can beelectrically configured as an integrated circuit, for example. Inanother example, each microelectronic element can include a plurality ofpassive circuit elements such as capacitors, inductors or resistors,which in some cases may be embodied in a semiconductor chip, either asonly passibe devices, or together with active circuit elements, i.e.active devices. In the embodiment shown, each package 10A and 10Bincludes two microelectronic elements 40, but in other embodiments apackage (such as those discussed below) can include more than twomicroelectronic elements such as three, four, or more.

In the exemplary embodiment of FIG. 1, the microelectronic elements 40are mounted on respective substrates in a face-down wire bondconfiguration. In this configuration, the microelectronic elements 40are mounted with their front faces 42 facing the front face 14 ofsubstrate 12. Element contacts 46 are exposed at front face of themicroelectronic element 40 and are electrically connected with substratewiring 22 that can include traces or contact pads either formed on or atleast partially embedded in substrate 12. In the embodiment shown, theelement contacts 46 are connected with the substrate wiring 22 by wirebonds 48 that pass through a window 32 in substrate 12. Although only apair of wire bonds 48 is shown in FIG. 1, a plurality of wire bond pairscan extend along a row (See FIG. 15) and can pass through a window thatis elongated to accept the multiple wire bond pairs. An encapsulant 50can surround and protect wire bonds 48 in the area of window 32 andalong portions thereof that extend outside of substrate 12 beyond theback surface 16 thereof. A molded dielectric layer 52 can at leastpartially surround microelectronic elements 40 including the edges 45thereof and, in the face-down arrangement of FIG. 1, front face 42.Molded dielectric layer 52 can further bond microelectronic elements 40to front face 14 of substrate 12. Molded dielectric layer 52 can definea surface 54 that can be substantially flush with back faces 44 ofmicroelectronic elements 40 or can overlie back faces 44 to fullyencapsulate microelectronic elements 40. Alternatively, as seen in FIG.1A, some or all of the leads may be beam leads 137 which extend in adirection parallel to a surface 123 or 124 of the second substrate 120and have portions aligned with aperture 126 and are joined to thecontacts 112 of the first microelectronic element 102.

Substrate wiring 22 can include a plurality of package terminals 26exposed at the back surface 16 of substrate 12. Package terminals 26 canbe electrically connected with either or both microelectronic elements40 of the package 10A or 10B and can further be interconnected with eachother. Package terminals 26 can be available for use in connectingpackage 10A or 10B with a component external to that package 10A,10B.For example, package terminals 26 in package 10A can be used to connectpackage 10A with circuit contacts 72 exposed at a surface of a circuitpanel 70 that can be a printed circuit board (“PCB”) or the like. Thepackage terminals 26 of package 10B illustrate another example, in whichpackage terminals 26 can be used to electrically connect with anotherpackage such as package 10A through structures of the package 10A, 10Bthat are discussed in greater detail below.

Microelectronic elements 40 are arranged along their respectivesubstrates 12 in package 10A,10B such that they are spaced apart on thefirst surface 14 to define an interconnect area 18 therebetween. In theembodiment shown in FIG. 1, the microelectronic elements 40 are arrangedsuch that respective edge surfaces 45 thereof face and are substantiallyparallel to each other in a spaced-apart manner to define interconnectarea 18 therebetwen. It is not necessary, however for edge surfaces 45to be parallel. In the embodiment shown interconnect area 18 can bebounded on two sides by the edges 45 of the microelectronic elements 40and on the remaining two sides by edges of substrate 12. In otherembodiments, interconnect area 18 can be considered bounded by animaginary boundary extending between the outsides of the microelectronicelements 40. In embodiments with, for example, four microelectronicelements 40, the interconnect area 18 can be bounded on four sides byedges 45 of the individual microelectronic elements 40. In embodimentswith more than four microelectronic elements, the interconnect area canbe fully enclosed by the microelectronic elements, for example, on asmany sides as there are microelectronic elements.

A plurality of stack terminals 28 are arranged within interconnect area18 exposed as front surface 14 of substrate 12. The term “exposed at”,as used herein does not refer to any specific means of attachment forstack terminals 28 onto substrate 12 or any relative positiontherebetween. Rather, it indicates that the electrically conductivestructure is available for contact with a theoretical point moving in adirection perpendicular to the surface of the dielectric structuretoward the surface of the dielectric structure from outside thedielectric structure. Thus, a terminal or other conductive structurewhich is exposed at a surface of a dielectric structure may project fromsuch surface; may be flush with such surface; or may be recessedrelative to such surface and exposed through a hole or depression in thedielectric. Stack terminals 28 can be an array of individual terminals28 that can include various rows or columns thereof. Other alternativearrangements of terminals 28 are also possible, including those withonly two stack terminals 28 or with more than two terminals in variouslocations selected based on connection with other elements of package10A or 10B. Stack terminals 28 can be a part of or can otherwise beconnected with substrate wiring 22 such that stack terminals 28 can beinterconnected with the microelectronic elements 40 of the same package10A or 10B, with other stack terminals 28 or with package terminals 26.

Stack terminals 28 can be used to connect the associated package 10A or10B with an external component that overlies front surface 14 ofsubstrate 12. In one example, a plurality of interconnect elements 56can be connected with stack terminals 28 and extend upwardly therefromto end surfaces 58 thereof that can be exposed at surface 54 of moldeddielectric layer 52. Interconnects 56 can be pins, posts, masses of bondmetal or other conductive material, such as may include solder or ametal such as copper, gold, silver, tin, bismuth, indium, aluminum,nickel, etc. In the embodiment shown interconnects 56 are in the form ofpins that extend away from front surface 14 of substrate 12 and extendthrough the molded dielectric layer 52. In such an embodiment, endsurfaces 58 can form terminals exposed at surface 54 for interconnectionwith another component. In other embodiments, end surfaces 58 can becovered by contacts that are connected therewith to provide a terminalwith a larger surface area than that of end surfaces 58 themselves.

As shown in FIG. 1, package 10B is mounted over package 10A, which canbe done for example, using adhesive layer 60 that can be formed from adielectric material such as epoxy or another curable material that canbe positioned between surface 54 of package 10A and second surface 16 ofthe substrate 12 of package 10B. Masses of conductive material or a bondmetal such as solder or the like, as described above, can connect theend surfaces 58 of the interconnects 56 of package 10A with the packageterminals 26 of package 10B. This arrangement, thusly, provides aconnection between stack terminals 28 of package 10A with packageterminals 26 of package 10B, which can facilitate a number of furtherconnections throughout the assembly 8. For example, this arrangement canprovide a connection between either or both of the microelectronicelements 40 of package 10B with circuit panel 70 and, accordingly, anyother components connected therewith. In another example, either or bothof the microelectronic components 40 of package 10B with either or bothof the microelectronic components of package 10A. The particularconnections facilitated by such a connection can be made by adapting thesubstrate wiring 22 within each package 10A and 10B, including theparticular connection made to the individual stack terminals 28.

A method for making a microelectronic assembly 8 such as that shown inFIG. 1 can include making or forming microelectronic packages 10A and10B in the configurations described above separately. Packages 10A and10B can then be aligned with each other, such that the correspondingpackage terminals 26 of package 10B align with the correspondinginterconnects 56 of package 10A. The corresponding package terminals 26of package 10B can then be electrically connected with the ends 58 oftheir respective interconnects 56 by joining together using, for examplea conductive bonding material such as solder or the like in the form ofmasses 62. Adhesive layer 60 can then be injected or otherwise depositedbetween facing surfaces 16 and 54 and around the bonding metal masses 62to secure packages 10A and 10B together.

In package 10A, some package terminals 26 and stack terminals 28 maydirectly overlie one another and can be electrically connected by a via30 that extends through substrate 12. In the specific embodiment shown,a via 30 can be exposed at ends thereof on front surface 14 and backsurface 16 such that the respective ends thereof are, respectively, thestack terminals 28 and the package terminals 26. Other embodiments arepossible, including those in which contact pads overlie via 30 to formstack terminals 28 and package terminals 26. As illustrated by package10A, vias 30 can be connected with substrate wiring 22 that extendsalong back surface 16 and includes package terminals that are displacedin one or more lateral directions from vias 30. A similar arrangement ispossible wherein the substrate wiring 22 extends along front surface 14and includes stack terminals 28 that are displaced from vias 30.Embodiments of a package such as package 10A that includes displacedpackage terminals 26 can also overlie another package (such as in theplace of package 10B) and such displacement can compensate for differentspatial placement of interconnects 56 in different packages or canredistribute the particular connections.

As shown in FIG. 2, additional microelectronic packages, such aspackages 10C and 10D can be included in an assembly 8. In the embodimentshown, packages 10C and 10D are similar in structure to package 10B suchthat the package terminals 26 of package 10C can be connected with theinterconnect 56 end surfaces 58 of package 10B. Similarly, the packageterminals 26 of package 10D can be connected with the interconnect 56end surfaces 58 of package 10C. In both instances the packages arebonded together using adhesive layers 62 and the package terminals 26can be connected with the end surfaces 58 of interconnects 56 usingbonding metal masses 62. As in the embodiment of FIG. 1, theinterconnection between packages 10A,10B,10C,10D can achieve a number ofdifferent interconnections between assembly elements. For example, themicroelectronic elements 40 of packages 10C and 10D can connect throughpackages 10A and 10B to circuit panel 70. Further, any of themicroelectronic elements 40 within assembly 8 can connect with any ofthe remaining microelectronic elements 40 through the interconnects 56of any intervening packages.

A method for making a package 8 as shown in FIG. 2 can be similar to themethod described above for making the package 8 of FIG. 1 withadditional, similar steps included to attach additional packages 10C and10D therewith.

A number of other types of packages can be connected in such a mannerusing stack terminals in an interconnect area between microelectronicelements. Further a number of different connections to such stackterminals to external package terminals are also possible. In theexamples shown in FIGS. 3A-3C, packages 110A and 110B are similar instructure to packages 10A and 10B, respectively, as shown in FIG. 1. Inthe embodiments of FIGS. 3A-3C, however, interconnects 156 are in theform of conductive masses, e.g. of a bonding metal, e.g. solder, tin,indium, gold, or combinations thereof, or other conductive bond materialsuch as conductive paste, a conductive matrix material, amont others. Inthe example shown in FIG. 3C, the bond metal interconnects 156 extendall the way from stack terminals 128 of package 110A to packageterminals 126 of package 110B. In such an embodiment, holes can be madein the molded dielectric layer 152 of package 110A to expose stackterminals 128 on surface 154. These holes can also extend throughadhesive layer 160 in cases where adhesive layer 160 is formed beforeassembly with package 110B. Otherwise bonding metal, such as solder, canbe deposited in such holes in contact with stack terminals 128 andpackage 110B can be assembled with package 110A and can interconnects156 can be connected with package terminals 126 by reflowing the bondingmetal. in one example, the adhesive layer 160 can then be injectedbetween packages 110A and 110B and around exposed portions of theinterconnects 156.

In the example of FIG. 3B, which is a variation of FIG. 3A, the stackterminals 128 and package terminals 126 are opposing surfaces of acontact pad 134 that is positioned adjacent the second surface 116 ofsubstrate 112 in package 110A. As shown, the stack terminals 128 areexposed at first surface 114 of substrate 112 by openings 136 insubstrate 112. In such an embodiment the bond metal interconnects 156can further extend into the openings 136 in substrate 112 to join withstack terminals 128. FIG. 3C shows a further variation of the example ofFIG. 3B in which the contact pads 134 are adjacent to first surface 114of substrate 112 of package 110A. Package terminals 126 are exposed atsecond surface 116 by openings 136 in substrate 112. Solder balls 174extend into openings 136 to connect with package terminals 126 forconnection with an external component, as discussed above. Package 110Bin FIG. 3C includes similar terminal structures as in package 110A. Bondmetal interconnects 156 extend through openings 136 in substrate 112 ofpackage 110B to connect with package terminals 126 thereof. In a methodfor making microelectronic packages 108, as shown in FIGS. 3A-3C,openings 136 can be included in package 110A prior to assembly withpackage 110B. Interconnect masses 156 can be included in openings 136when package 110A is provided for assembly with package 110B. Masses 156can then be heated to re-flow the bonding material for joining withpackage terminals 126 of package 110B. Alternatively, openings 136 canbe left unfilled prior to assembly, at which point bonding metal can bedeposited therein in a flowable state and can be further joined withpackage terminals 126 of package 10B. In a further alternative, openings136 can be filled with bond metal interconnects 136 that aresubstantially even with surface 154 of molded dielectric 152. Atassembly additional bonding metal can be added thereto and joined withpackage terminals 126 of package 110B.

FIG. 4 shows a further alternative arrangement wherein a window 219 isformed through substrate 212 of package 210B such that the interconnects256 can be in the form of wire bonds that connect stack terminals 228 ofpackage 210A directly to stack terminals 228 of package 210B. In such anembodiment, the substrate wiring 222 of package 210B can connect betweenstack terminals 228 and the wire bonds 248 that are on the opposite face216 from stack terminals 228. In some cases a single molded dielectric250 can be formed at once which encapsulates the microelectronicelements 240 and the wire bonds 248 that connect microelectronicelements 240 to substrate wiring 222 and the interconnect wire bonds256. As further shown in FIG. 4 additional stack terminals 226 can beexposed at first surface 214 of substrate 212 of package 210A in aperipheral area outside of the microelectronic elements 240. Similarly,additional stack terminals 228 can be exposed at the first surface 214of substrate 212 of package 210B such that additional wire bondinterconnects 256 can connect between the stack terminals 228 ofpackages 210A and 210B in the peripheral areas thereof. Additionalexamples of assemblies incorporating wire bonds through substratewindows to interconnect packages are described in co-pending,commonly-owned U.S. patent application Ser. Nos. 11/666,975 and13/216/415, the disclosures of which are incorporated by referenceherein in their entireties.

In further variations shown in FIGS. 5A and 5B, packages 310A and 310Bcan include microelectronic elements 340 that include element contacts346 on the front face 342 thereof. Such microelectronic elements 340 areflip-chip bonded on substrates 312 such that element contacts 346 areconnected to substrate wiring 322, including substrate contacts on thefirst surface 314 of substrate 312 by solder balls 348. The example ofFIG. 5B further shows interconnects 356 in the form of metalized viasthat extend through the vias 330 (or other similar structures) thatdefine package terminals 326 and stack terminals 328 of package 310B toelectrically connect therewith. The vias 356 further extend throughmolded dielectric 352 of package 310A and adhesive layer 360 to connectwith stack terminals 328 of package 310A. In the example shown in FIG.5B, vias further extend through molded dielectric 352 of package 310Bsuch that vias 356 can be made by first forming corresponding openingsthrough package 310B, including molded dielectric 352, stack terminals328, package terminals 326 and any structure (such as the remainder ofvias 330 or any portion of substrate 312) therebetween. Such openingsare further formed through adhesive layer 360 and through moldeddielectric 352 of package 310A. In some embodiments, the openings canalso extend through stack terminals 328 and any associated structuresuch as vias 330. The openings are then filled with a conductivematerial such as copper or another wiring metal discussed herein. Suchconductive metals can be deposited in openings by plating or the like.Alternatively, depending on the size of the openings and other factorsincluding the thicknesses of the respective packages 310A and 310B, aconductive paste or bonding metal can be deposited in the openings toachieve the desired electrical connection. The vias 356 discussed withrespect to FIG. 5B for connection between packages 310A and 310B can beused to form similar connections in the other examples of packages andassemblies thereof discussed herein.

Packages of the types described herein can be assembled with additionalpackages of similar types by connecting with either the packageterminals or the stack terminals of such additional packages. In anexample, packages of any of the types described herein can be mounted toeach other in a face-to-face arrangement such as those shown in FIGS. 6and 7. For example, in FIG. 6, packages 410A and 410B are positionedsuch that their respective dielectric surfaces 454 face each other andsuch that interconnect 456 end surfaces 458 are mutually aligned. Solderballs 462 can electronically connect the aligning interconnect 456 endsurfaces 458 and an adhesive layer 460 can affix the two packages 410Aand 410B. In a similar example, two packages can be attachedback-to-back with solder balls connecting facing and aligning packageterminals with an adhesive layer between facing back surfaces ofrespective package substrates. These examples can further be combined toassemble two sets of face-to-face bonded packages, such as packages 410Aand 410B in FIG. 6 together. FIG. 7 shows a variation of the embodimentof FIG. 6 wherein a heat spreader 464 is disposed between packages 410Aand 410B. Heat spreader 464 includes a window 466 therein through whichinterconnects 456 can pass. In anther example, heat spreader 464 can betwo discrete heat spreaders 464, with one being disposed on each side ofinterconnect area 418. In such an embodiment, window 466 can be in theform of a gap defined between the two separate heat spreaders 464.

Similar stack terminal arrangements can also be incorporated intomultiple die arrangements in wafer-level packages. As shown in FIG. 8,packages 510A and 510B are both wafer level packages including twomicroelectronic elements 540. In this case, the substrate can be omittedsuch that the microelectronic packages 510A and 510B can be in form of amicroelectronic elements 540 having packaging structure which includesan electrically conductive redistribution layer overlying the frontfaces 542 of the microelectronic elements 540. The redistribution layerhas electrically conductive metallized vias 530 extending through adielectric layer 538 of the package to contacts 546 of themicroelectronic elements The redistribution layer includes packageterminals 526 and traces electrically connected with the terminals 526,such that the terminals are electrically connected with the contacts546, such as through the metallized vias 536 or through metallized vias536 and electrically conductive traces. In the particular embodiment ofFIG. 8, where package terminals 526 and stack terminals 528 are disposedon areas of the dielectric layer 538 which extend beyond one or moreedges of the microelectronic elements 540, such as in interconnect area518, the packages 510A and 510B can further be referred to as “fan-outwafer-level packages”. Stack terminals 528 and package terminals 526 canbe opposing surfaces of contact pads 534 that are incorporated in theredistribution circuitry 522 of each wafer level package 510A,510Bwithin dielectric layer 538.

As in the embodiment of FIG. 1, interconnects 556 such as pins or thelike can extend through molded dielectric 552 and, if necessary throughdielectric layer 538, to end surfaces 558 thereof that are exposed onsurface 554. This structure allows package 510B to be assembled overpackage 510A with the package terminals of package 510B connected withinterconnect end surfaces 558. As described above, this connectionconfiguration facilitates a number of different particular connectionsbetween the components of the packages 510A and 510B and connectiontherewith to external components, such as by connection of packageterminals 526 of package 510A to circuit contacts of a PCB or the like.Such a connection can be achieved, as shown in FIG. 8 by bonding packageterminals 526 of package 510A, for example, directly to circuit contacts572. Alternatively, as shown in FIG. 9, a package substrate 576 can beincluded in assembly 508 that connects to package terminals 526 ofpackage 510A via solder balls 562. Package substrate 576 can thenconnect to circuit contacts 572 by solder balls 574 connected to packagecontacts 576. In an alternative example, shown in FIG. 10, packageterminals 526 of package 510A can be wire bonded to wiring withinpackage substrate 576 that connects to package contacts 578.

FIGS. 11 and 12 show examples of assemblies 508 that include wafer levelpackages 510A and 510B in arrangements that are similar to those shownin FIGS. 6 and 7. In particular packages 510A and 510B are assembledface-to-face with solder balls 562 connecting facing and mutuallyaligned interconnect 556 end surfaces 558. A adhesive layer 560 canattach between facing surfaces 554 of the respective packages 510A and510B. The embodiment of FIG. 500 incorporates a heat spreader 564 in asimilar manner to that of FIG. 7. Multiple sub-assemblies offace-to-face bonded packages can be assembled together, as discussedabove.

As shown in FIG. 13, assemblies with additional packages 510C and 510Dby continuing to assemble packages on top of each other and connectingadjacent pairs of package terminals 526 and interconnect 556 endsurfaces 558 in a similar manner to that discussed with respect to FIG.2. Even more than the four packages shown in FIG. 13 can be included insuch an assembly.

As previously discussed, any of the assemblies discussed above in FIGS.1-13 can be adapted to include more than two microelectronic elements ineach package. FIGS. 14-17 show further examples of an assembly of thetype shown in FIG. 8 having four microelectronic elements 640 in eachpackage 610. In particular, FIG. 15 shows a top schematic view of apackage 610 that can be used in the assembly of FIG. 14. In thisembodiment, microelectronic elements 640 are arranged such that edges645 are arranged in a square along surface 614 of substrate 612. Thisarrangement defines interconnect area 618 in the square area defined byedges 645. As in previously-discussed embodiments, stack terminals 628are arranged in an array on front surface 614 of substrate 612 withininterconnect area 618. As discussed previously, package terminals 626are exposed on back surface 616 of substrate 612 and can directly alignwith stack terminals 628 or be offset therefrom.

In addition to the interconnect area 618 defined within the fourmicroelectronic elements 640, as shown in FIG. 15, adjacent pairs ofmicroelectronic elements 640 define outer interconnect areas 620 betweenedges 645 thereof and the boundary of substrate 612. Additional stackterminals 628 can be exposed on front surface 614 of substrate 612 inthese outer interconnect areas 620 as well. In the example shown in FIG.15, four such outer interconnect areas 620 are defined on substrate 612;however, more of fewer outer interconnect areas can be present,depending on the number of microelectronic elements included in a givenpackage.

In an assembly 608 of packages 610 of the type shown in FIGS. 14 and 15,the stack terminals 628 within different interconnect areas 618 and 620can be used to carry different signals, depending on their location orcan be interconnected with different combinations of microelectronicelements 640. For example, the stack terminals 628 within interconnectarea 618 can be interconnected with more than one of the microelectronicelements 640 to carry common signals to two, three or all of themicroelectronic elements 640. As shown in FIG. 15, one such stackterminal 628A can connect with all microelectronic elements 640. In afurther example, the stack terminals within outer interconnect area 620can connect with only one of the microelectronic elements 640 that boundit or with both of the microelectronic elements that bound thatparticular outer interconnect area 640. In an embodiment, the stackterminals 628C within an outer interconnect area 640 can connect withonly the closest one of the microelectronic elements 640C to carry asignal that is specific to that microelectronic element. The remainingstack terminals can be connected with the various microelectronicelements 640 according to this scheme. To do so may be advantageous dueto the relative distances between the stack terminals 628 and themicroelectronic elements 640 because the stack terminals 628 in theouter interconnect areas 620 can be at too disparate a distance betweenopposite microelectronic elements (such as microelectronic elements 640Aand 640B) to carry common signals. This can be due to the additionaltime required for such signals to reach the farther of themicroelectronic elements 640. Conversely, the stack terminals 628 withininterconnect area 618 can be close enough in distance to allmicroelectronic elements 640 to reliably carry common signals.

In certain embodiments of the invention, the microelectronic elements inthe package include microelectronic elements configured to providememory storage array function. For example, the microelectronic elementscan provide dynamic random access memory (“DRAM”) function, and may insome cases include or be dedicated DRAM chips. In such case, the stackterminals 628 in the interconnect area may be configured to carry all ofa group of command-address bus signals to the second microelectronicpackage 601B. Packages that have centrally located terminals configuredto carry command, address, and timing signals can be as furtherdescribed in commonly owned U.S. Provisional Patent Application No.61/506,889 filed Jul. 12, 2011 (the “'889 Application”), U.S.Provisional Patent Application No. 61/542,488 filed Oct. 3, 2011 (the“'488 Application”), and U.S. Provisional Patent Application No.61/542,553 filed Oct. 3, 2011 (the “'553 Application”), the disclosuresof said '889, '488, and '553 Applications being incorporated byreference herein. Typically, the command-address bus signals can bebussed on a circuit panel such as a printed circuit board or module cardto multiple microelectronic packages in parallel, particularly tomicroelectronic packages mounted to the same or to opposite surfaces ofthe circuit panel. In one example, such a circuit panel can be amotherboard or single-inline memory module or “SIMM” or dual-inlinememory module or “DIMM” module board. In a particular example, thecommand-address bus signal terminals of the interconnect area can beconfigured to carry all of a group of command signals, address signals,bank address signals and clock signals, wherein the command signals arewrite enable, row address strobe, and column address strobe, and theclock signals are sampling clocks used for sampling the address signals.While the clock signals can be of various types, in one embodiment, theclock signals carried by these terminals can be one or more pairs ofdifferential clock signals which are received as differential or trueand complement clock signals. In yet another example, package terminalsaligned with the stack terminals or disposed on the outwardly-facingsurface of the substrate will also include command-address bus signalterminals for mating with a circuit panel, or for mating with the stackterminals of a like package.

In one embodiment, the microelectronic package can be functionallyequivalent to a SIMM or a DIMM, and the stack terminals in theinterconnect area of the package, and the package terminals connectedthereto, may be configured to carry all of a group of command-addressbus terminals; i.e., all of the command signals, address signals, bankaddress signals, and clock signals transferred to the package, thecommand signals being write enable, row address strobe, and columnaddress strobe signals, and the clock signals being sampling clocks usedfor sampling the address signals. In a particular embodiment, thepackage may incorporate a buffer element, e.g., an integrated circuittherefor, which is configured to regenerate the command-address bussignals received at the package terminals and transmit the regeneratedsignals on the stack terminals to additional packages which may beassembled therewith, as also described in the '488 Application. In suchcase, the microelectronic package may be functionally equivalent to aregistered DIMM or “RDIMM”. In another example, the microelectronicpackage may be functionally equivalent to a load-reduced DIMM (“LRDIMM”)in which case, the buffer element can be configured to regenerate all ofthe data signals received by the microelectronic package and transmitthe same to one or more additional microelectronic packages assembledtherewith.

In a particular example, the microelectronic package can be configuredto transfer, i.e., receive by the package, or transmit from the packagethirty-two data bits in parallel in a clock cycle. In another example,the microelectronic package can be configured to transfer sixty-fourdata bits in parallel in a clock cycle. A number of other data transferquantities are possible, among which only a few such transfer quantitieswill be mentioned without limitation. For example, the package can beconfigured to transfer 72 data bits per clock cycle which may include aset of 64 underlying bits which represent data and 8 bits which areerror-correction code (“ECC”) bits for the 64 underlying bits.Ninety-six data bits, 108 bits (data and ECC bits), 128 data bits and144 bits (data and ECC bits) are other examples of data transfer widthsper cycle that the microelectronic package may be configured to support.

FIGS. 16 and 17 show additional examples of how microelectronic elements640 can be arranged in a four microelectronic element package 610. InFIG. 16, the microelectronic elements 640 are staggered and do notoverlap (as they do in FIG. 15), which eliminates the outer interconnectareas 620. In particular, the microelectronic elements 640 in thearrangement of FIG. 16 can be described as having inside edge surfaces645A extending along a plane that intersects an adjacent inside edgesurface 645A of another microelectronic element 640. In this anembodiment, stack terminals 628 within interconnect area 618 can carryboth common and specific signals. As shown in FIG. 16, substrate 612 canextend outside of the areas that microelectronic elements 640 overlie todefine a continuous outer interconnect area 620 surrounding themicroelectronic elements 640 and including stack terminals 628 therein.These stack terminals 628 can connect with adjacent microelectronicelements to carry signals specific to that element with common signalscarried by stack terminals 628 within the interconnect area 618surrounded by the microelectronic elements 640.

In FIG. 17 a non-overlapping arrangement of microelectronic elements 640is shown that, as in the embodiment of FIG. 15, defines outerinterconnect areas 620 having stack terminals 628 therein. In such anarrangement, inside edge surfaces 645A extend along planes such thateach microelectronic element 640 is positioned between two such planesdefined by inside edge surfaces 645A of adjacent microelectronicelements 640. As used herein, “between” can include an arrangement wherea microelectronic element is tangent to such a plane.

Various embodiments of the connection components described herein can beused in connection with various diverse electronic systems. Theinterconnection components described above can be utilized inconstruction of diverse electronic systems, as shown in FIG. 18. Forexample, a system 1 in accordance with a further embodiment of theinvention can include a microelectronic assembly 8, being a unit formedby assembly of microelectronic packages 10A and 10B, similar to themicroelectronic assembly 8 shown in FIG. 1. The embodiment shown, aswell as other variations of microelectronic assemblies, as describedabove can be used in conjunction with other electronic components 6 and3. In the example depicted, component 6 can be a semiconductor chip orpackage or other assembly including a semiconductor chip, whereascomponent 3 is a display screen, but any other components can be used.Of course, although only two additional components are depicted in FIG.18 for clarity of illustration, the system may include any number ofsuch components. In a further variant, any number of microelectronicassemblies including a microelectronic element and an interconnectioncomponent can be used. The microelectronic assembly and components 6 and3 are mounted in a common housing 4, schematically depicted in brokenlines, and are electrically interconnected with one another as necessaryto form the desired circuit. In the exemplary system shown, the systemincludes a circuit panel 70 such as a flexible printed circuit board,and the circuit panel includes numerous conductors 72 interconnectingthe components with one another. However, this is merely exemplary; anysuitable structure for making electrical connections can be used,including a number of traces that can be connected to or integral withcontact pads or the like. Further, circuit panel 70 can connect toassembly 8 using solder balls 74 or the like. The housing 4 is depictedas a portable housing of the type usable, for example, in a cellulartelephone or personal digital assistant, and screen 3 is exposed at thesurface of the housing. Where system 1 includes a light-sensitiveelement such as an imaging chip, a lens 5 or other optical device alsomay be provided for routing light to the structure. Again, thesimplified system 1 shown in FIG. 18 is merely exemplary; other systems,including systems commonly regarded as fixed structures, such as desktopcomputers, routers and the like can be made using the structuresdiscussed above.

Although the description herein has been made with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent disclosure. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present disclosure as defined by the appended claims.

1. A microelectronic assembly, comprising: a first microelectronicpackage, including: a substrate having first and second opposed surfacesand substrate contacts thereon; first and second microelectronicelements each having element contacts electrically connected with thesubstrate contacts, the first and second microelectronic elements beingspaced apart from one another on the first surface so as to provide aninterconnect area of the first surface between the first and secondmicroelectronic elements; a plurality of package terminals at the secondsurface electrically interconnected with the substrate contacts forconnecting the package with a component external to the package; and aplurality of stack terminals exposed at the first surface in theinterconnect area for connecting the package with a component overlyingthe first surface of the substrate; and a second microelectronic packageoverlying the first microelectronic package and having terminals joinedto the stack terminals of the first microelectronic package.
 2. Themicroelectronic assembly of claim 1, wherein the package terminals andthe stack terminals overlie each other in respective electricallyconnected pairs.
 3. The microelectronic assembly of claim 2, wherein thepackage terminals and the stack terminals are opposite ends ofconductive vias through the substrate.
 4. The microelectronic assemblyof claim 1, wherein additional ones of the stack terminals are at thefirst surface of the substrate in a portion thereof that is outside ofthe interconnect area.
 5. The microelectronic assembly of claim 4,wherein at least some of the stack terminals are connected with both ofthe first and second microelectronic elements.
 6. The microelectronicassembly of claim 5, wherein at least some of the stack terminals thatare connected with both of the first and second microelectronic elementsare configured to carry at least one of command, address, and timingsignals.
 7. The microelectronic assembly of claim 1, wherein the firstmicroelectronic package further includes third and fourthmicroelectronic elements spaced on opposite sides of the interconnectarea between the first and second microelectronic elements.
 8. Themicroelectronic assembly of claim 7, wherein additional ones of thestack terminals are positioned in a corner region of the substratebounded by adjacent ones of the microelectronic elements.
 9. Themicroelectronic assembly of claim 7, wherein the third and fourthmicroelectronic elements respectively overlap with the first and secondmicroelectronic elements in corner regions thereof adjacent to cornersof the interconnect area defined thereby.
 10. The microelectronicassembly of claim 7, wherein each of the first, second, third, andfourth microelectronic elements has an edge that defines a side of theinterconnect area, and wherein each of the edge surfaces extends along aplane that interests the edge surface of an adjacent microelectronicelement.
 11. The microelectronic assembly of claim 7, wherein each ofthe first, second, third, and fourth microelectronic elements has anedge surface that defines at least a portion of a side of theinterconnect area, and wherein each of the edge surfaces extends along aplane with each of the microelectronic elements positioned between twoadjacent planes.
 12. The microelectronic assembly of claim 1, whereinthe first microelectronic package further includes a molded encapsulantlayer overlying at least a portion of the first surface of thesubstrate, and wherein at least portions of the first conductiveinterconnects comprise first conductive vias extending through themolded encapsulant layer to exposed ends.
 13. The microelectronicassembly of claim 1, wherein contact-bearing faces of the first andsecond microelectronic elements face the substrate, the substratecontacts including substrate contacts exposed at the second surface, andwherein the element contacts are connected with the substrate contactsby wire bonds.
 14. The microelectronic assembly of claim 1, includingsubstrate contacts exposed at the first surface and wherein the elementcontacts of the first and second first microelectronic elements face thesubstrate contacts exposed at the first surface and are joined thereto.15. The microelectronic assembly of claim 1, wherein the secondmicroelectronic package includes a third microelectronic element mountedon a second substrate, the terminals being on the second substrate andelectrically connected with the third microelectronic element.
 16. Themicroelectronic assembly of claim 1, wherein the second microelectronicpackage includes a substrate having first and second spaced apartsurfaces and third and fourth microelectronic elements mounted on thesecond surface thereof, the third and fourth microelectronic elementsbeing spaced apart on the substrate of the second package to define aninterconnect area therein, and the terminals being exposed at the secondsurface of the substrate of the second package within the interconnectarea, the substrate of the second package further including a windowextending therethrough between the first and second surfaces thereof,and wherein the terminals of the second package are joined to the stackterminals of the first package by wire bonds that extend through thewindow.
 17. The microelectronic assembly of claim 16, wherein thesubstrate of the first package defines a peripheral area surrounding atleast one of the first and second microelectronic elements, additionalstack terminals being located in the peripheral area, wherein thesubstrate of the second package defines a peripheral area surrounding atleast one of the third and fourth microelectronic elements and aperipheral edge bounding the peripheral area, additional terminals beinglocated in the peripheral area thereof, and wherein at least some of theadditional stack terminals of the first package are joined with at leastsome of the additional terminals of the second package by wire bondsthat extend past the peripheral edge of the substrate of the secondpackage.
 18. The microelectronic assembly of claim 1, further includinga third microelectronic package underlying the first microelectronicpackage and having terminals joined to the package terminals of thefirst microelectronic package.
 19. The microelectronic assembly of claim1, further including a circuit panel with circuit contacts exposed at asurface thereof, wherein the package terminals of the firstmicroelectronic package are electrically connected with the circuitcontacts.
 20. The microelectronic assembly of claim 1, wherein thesecond microelectronic package terminals are at least one of packageterminals or stack terminals.
 21. The microelectronic assembly of claim20, wherein the stack terminals of the first package are electricallyconnected with the package terminals of the second package.
 22. Themicroelectronic assembly of claim 20, wherein stack terminals of thefirst and second packages are electrically connected.
 23. Themicroelectronic assembly of claim 22, further including a heat spreaderbetween the first and second microelectronic packages.
 24. Themicroelectronic assembly of claim 23, wherein the heat spreader includesan aperture formed therethrough that overlies at least a portion of theinterconnect area, the stack terminals of the second microelectronicpackage being connected with the stack terminals of the firstmicroelectronic package through the aperture.
 25. The microelectronicassembly of claim 23, wherein the heat spreader is a first heatspreader, the assembly further including a second heat spreader, thefirst heat spreader being disposed on a first side of the interconnectarea and the second heat spreader being disposed on a second side of theinterconnect area with a gap being defined between the first and secondheat spreaders, the stack terminals of the second microelectronicpackage being connected with the stack terminals of the firstmicroelectronic package through the gap.
 26. A microelectronic assembly,comprising: a first microelectronic package, including: first and secondmicroelectronic elements each having front faces and back faces thereofand element contacts exposed at the respective front faces, the firstand second microelectronic elements being laterally spaced apart fromone another so as to provide an interconnect area therebetween; adielectric layer having a surface overlying the front faces of the firstand second microelectronic elements and facing away from the front facesof the microelectronic elements, the dielectric layer further having asecond surface opposite the first surface; a plurality of packageterminals exposed at the first surface of the dielectric layer andelectrically connected with the element contacts through tracesextending along the dielectric layer and first metallized vias extendingfrom the traces and contacting the element contacts; and a plurality ofstack terminals exposed at the second surface of the dielectric layerand electrically connected with the package terminals for connecting thepackage with a component overlying the second surface of the dielectriclayer; and a second microelectronic package overlying the firstmicroelectronic package and having terminals joined to the stackterminals of the first microelectronic package.
 27. The assembly ofclaim 26, wherein the first package further includes: a moldedencapsulation layer at least partially surrounding the first and secondmicroelectronic elements within the interconnect area and defining asurface thereof overlying the second surface of the dielectric layer;and conductive interconnects electrically connected with the stackterminals and having end surfaces exposed at the surface of the moldedencapsulation layer.
 28. A microelectronic assembly, comprising: a firstpackage, including: a substrate having first and second opposedsurfaces; first and second microelectronic elements each having elementcontacts electrically connected with corresponding substrate contacts onthe first surface, the first and second microelectronic elements beingspaced apart from one another on the first surface so as to provide aninterconnect area of the first surface between the first and secondmicroelectronic elements; a plurality of package terminals at the secondsurface electrically interconnected with the substrate contacts forconnecting the package with a component external to the package; aplurality of stack terminals exposed at the first surface of thesubstrate in the interconnect area and electrically connected with atleast some of the package terminals; a second microelectronic packageoverlying the first microelectronic package and having terminals; aplurality of conductive interconnects joined between the stack terminalsof the first microelectronic package and the terminals of the secondmicroelectronic package.
 29. The microelectronic assembly of claim 28,wherein the second microelectronic package further includes a seconddielectric layer having first and second opposed surfaces and at leastone microelectronic element mounted on the first surface of thedielectric layer.
 30. A microelectronic assembly, comprising: a firstpackage, including: a substrate having first and second opposedsurfaces; four microelectronic elements each having element contactselectrically connected with corresponding substrate contacts on thefirst surface, the microelectronic elements being arranged on the firstsurface so as to define an interconnect area of the first surfacesurrounded by the microelectronic elements; a plurality of packageterminals at the second surface electrically interconnected with thesubstrate contacts for connecting the package with a component externalto the package; and a plurality of stack terminals at the first surfacein the interconnect area electrically connected with the packageterminals a second microelectronic package overlying the firstmicroelectronic package and having terminals; conductive interconnectsjoined between the stack terminals of the first microelectronic packageand the terminals of the second microelectronic package.
 31. Themicroelectronic assembly of claim 30, wherein each of themicroelectronic elements includes a peripheral edge adjacent to theinterconnect area such that the interior interconnect area is defined asa rectangular area.
 32. The microelectronic assembly of claim 30,wherein at least some of the first stack terminals are electricallyconnected with at least two of the first microelectronic elements.
 33. Amicroelectronic assembly, comprising: a first package, including: asubstrate having first and second opposed surfaces; first and secondmicroelectronic elements each having element contacts electricallyconnected with corresponding substrate contacts on the first surface,the first and second microelectronic elements being spaced apart fromone another on the first surface so as to provide an interconnect areaof the first surface between the first and second microelectronicelements; a plurality of contact pads having surfaces exposed at thesecond surface of the substrate, the surfaces of the contact padsdefining package terminals electrically interconnected with thesubstrate contacts for connecting the package with a component externalto the package; and a molded encapsulant layer overlying at least aportion of the first surface of the substrate and defining anencapsulant surface; and a second microelectronic package bonded to theencapsulant surface and having terminals facing the encapsulant surface;a plurality of conductive vias extending at least through the moldedencapsulant layer and connecting the contact pads of the firstmicroelectronic package and the terminals of the second microelectronicpackage.
 34. The assembly of claim 33, wherein the conductive viasfurther extend through the contact pads of the first package inelectrical contact therewith.
 35. The assembly of claim 33, wherein thesecond microelectronic package further includes a substrate having firstand second spaced apart surfaces, the second surface being bonded to theencapsulant surface, wherein the terminals of the second package aresurfaces of conductive pads exposed at the second surface of thesubstrate, and wherein the conductive vias further extend through theconductive pads of the second package in electrical contact therewith.36. A system comprising a microelectronic assembly according to claim 1and one or more other electronic components electrically connected tothe microelectronic assembly.
 37. A method for making a microelectronicassembly, comprising: assembling a first microelectronic package with asecond microelectronic package, the second microelectronic packageoverlying the first microelectronic package and having terminalsthereon, the first microelectronic package including: a substrate havingfirst and second opposed surfaces and substrate contacts thereon; firstand second microelectronic elements each having element contactselectrically connected with the substrate contacts, the first and secondmicroelectronic elements being spaced apart from one another on thefirst surface so as to provide an interconnect area of the first surfacebetween the first and second microelectronic elements; a plurality ofpackage terminals at the second surface electrically interconnected withthe substrate contacts for connecting the package with a componentexternal to the package; and a plurality of stack terminals exposed atthe first surface in the interconnect area for connecting the packagewith a component overlying the first surface of the substrate; andconnecting the terminals of the second microelectronic package with thestack terminals of the first microelectronic package to form anelectrical connection therebetween.
 38. The method of claim 37, whereinthe step of connecting the terminals of the second microelectronicpackage with the stack terminals of the first microelectronic packageincludes joining the package terminals to exposed ends of interconnectson an encapsulant layer of the first microelectronic package overlyingthe first surface of the substrate at least in the interconnect areathereof, the interconnects being joined to the stack terminals oppositethe exposed ends thereof.
 39. The method of claim 37, wherein the stepof connecting the terminals of the second microelectronic package withthe stack terminals of the first microelectronic package includesdepositing conductive bond material masses into holes within anencapsulant layer of the first microelectronic package overlying thefirst surface of the substrate at least in the interconnect area, thestack terminals being exposed at a surface of the encapsulant layerwithin the holes, and wherein the conductive bond material masses arejoined to the terminals of the second package and the stack terminals ofthe first package.
 40. The method of claim 37, wherein the step ofconnecting the terminals of the second microelectronic package with thestack terminals of the first microelectronic package includes: forming aplurality of holes through at least an encapsulant of the firstmicroelectronic package overlying the first surface of the substrate inat least the interconnect area thereof, the plurality of holes beingaligned with respective ones of the stack terminals at first endsthereof and with corresponding ones of the terminals of the secondpackage at second ends thereof; and filling the holes with a conductivematerial in contact with the stack terminals of the firstmicroelectronic package and the package terminals of the second package.41. The method of claim 40, wherein the holes are further formed throughthe substrate of the first package and through the respective stackterminals thereof.
 42. The method of claim 40, wherein the holes arefurther formed through a substrate of the second package and through thecorresponding terminals thereof.
 43. The method of claim 37, wherein thefirst microelectronic package further includes third and fourthmicroelectronic elements spaced on opposite sides of the interconnectarea between the first and second microelectronic elements, and whereinthe step of connecting the terminals of the second microelectronicpackage with the stack terminals of the first microelectronic packagefacilitates a connection between the first, second, third, and fourthmicroelectronic elements of the first package to the second package.